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["序号","项目","问题描述","修改意见","备注","最终结果"]
[1,"天线","FPC柔性天线焊点由于挤压拉扯的原因导致焊点脱落,信号减弱一半,影响游戏","使用0.6mm厚度的硬PCB天线代替,需要解决天线和鞋底EVA粘合问题以及验证和FPC柔性天线的性能对比",null,"OK"]
[2,"磁吸充电","磁吸充电线接触的弹片容易缩回去不弹起来,有时候需要旋转一点才能接触到","使用单触点的磁吸充电头,接触弹片越大越可靠"]
[3,"配对","此版本配对方式是使用单独一根线进行,使充电头复杂程度增加,导致充电头和充电线生产困难","修改为使用与充电电源输入端分时复用一条线,降低充电头难度",null,"OK"]
[4,"区分左右鞋","主芯片PCB板靠一个电阻分左右鞋,导致容易焊错或者装错,如果坏掉一边,也容易造成浪费","主芯片PCB增加一个三轴加速度计和前面的IMU的加速度形成一个相对的正反面来软件区分左右鞋,硬件不区分,只在装大底的时候把主芯片盒子倒过来装就可以","这个国产的三轴加速度一致性不行，需要更换进口的或者在生产PCB时检测"]
[5,"主芯片盒子外壳","不支持翻转安装","前面开一条线槽,翻转过来安装导线不受影响(大底模具也需要相应修改)",null,"OK"]
[6,"前后脚传感器结构件","灌胶时容易漏胶","调整灌的胶"]
[7,"前脚传感器","读不到地磁数据,原因是地磁虚焊,导致接触不良","更改封装并与贴片加工厂改进钢网"]
[null,"前脚传感器","读不到地磁数据,原因是因为没有设置上拉电阻,导致iic驱动比较弱,信号读不到","设置IMU内部上拉电阻","上拉电阻（4.7K）增加了功耗（约200ua）\n可以用47K电阻，但效果还要测试"]
[8,"前脚传感器","出线的位置受到结构件(硬的)挤压弯折导致断线","改变出线方向并改成粗一些的导线"]
[9,"前脚传感器","IMU损坏,损坏现象为芯片表面有一个坏点,像是烧坏的,但电流最大为12ma,按理不会烧掉,所以不能确定","待再测,让平爷再次跑步测试"]
[10,"待机功耗变大","灌的胶料有问题，导致漏电","换成UV胶"]
[11,"黑色鞋子天线信号变弱","TPU上的电镀层（金属层）吸收了信号，导致信号减弱","遮盖天线的TPU不能电镀"]
[12,"前脚明显有异物感","传感器灌胶时凸出来，再加上中底EVA缩水导致坑太浅","1、灌胶时一定不能凸出表面\n2、让鞋厂一定要注意EVA的缩水"]
[13,"电机振动异响","电机槽太宽，导致电机振动时有多余的空间撞击外壳发出异响","电机也灌胶粘牢，但胶一定要稍稠一些的，否则会导致电机不振动"]
[14,"充电5V短路","原因是天线外皮太薄，并且靠近充电芯片的正电引脚，用力压天线时会导致短路","天线需要离开其他焊接点一些距离，保证不直接接触一起"]
[15]
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[17]
[18]
[19]
[20]
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[22]
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[26]
[27]